Due to different PCB heating performance, component size and material differences, the actual heating temperature rise of each point is different. The mounted board must be used for measurementįirstly, conduct thermal analysis on PCB components.When using a temperature measuring instrument, there are the following methods to pay attention to: ![]() After the test is recorded, connect the tester to the printer to print out the temperature curves in different temperature zones. Follow the editing process Sampling and recording the furnace temperature at the same time as the speed. When measuring, you can use solder and high-temperature tape to fix it on the test point, turn on the switch of the tester, and the thermometer enters the cavity of the furnace together with the PCBA. When measuring the temperature of the reflow soldering furnace temperature curve, you need to use a temperature curve tester. Therefore, it is very important to control the reflow soldering temperature curve of the chip processing. Improve the welding quality, thereby improving the welding pass rate and reducing the welding defect rate. The temperature of different zones needs to be different, so as to achieve excellent performance. Reflow soldering generally has 4 temperature zones, which are heat-absorbing zone, constant temperature zone, welding zone, and cooling zone. ![]() Together, prevent falling off and let the electronic components play their respective roles. The front end of chip processing is to print solder paste and mount electronic components, and the rear end needs reflow soldering at high temperature to melt the solder paste and fix the electronic components and pads tightly. SMT chip processing is the mainstream method of electronic product production at present.
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